Consumer Electronics

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Fevicol SR 998 FW /TF

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Reliable Bonding for Device Assembly

From smartphones to wearables, Pidilite adhesives provide strong, consistent performance for the compact, high-precision world of consumer electronics.

Adhesives for Bonding Screens, Frames, and Internal Components

Designed for clean application, reworkability, and long- term performance under thermal and mechanical stress.

Engineered adhesives for evolving consumer tech

As devices get slimmer, faster, and smarter, the adhesives that hold them together need to keep pace. At Pidilite, we develop solutions tailored to the electronics industry’s evolving challenges – be it tight tolerances, thermal stress, or multi-layered assemblies.

Our adhesive systems are built for precise application, long-term durability, and clean aesthetics. With strong R&D backing and a focus on global standards, we help OEMs and component suppliers deliver reliable, high-performance products – faster to market

What's Your Application?

Upper Making

Primer

Pidiprimer EP 294

Flammability: Flammable
Characteristic odour
Facilitates the adhesion of polyurethane adhesive to difficult substrates

Upper Making

Primer

Pidiprimer EP 294

Flammability: Flammable
Characteristic odour
Facilitates the adhesion of polyurethane adhesive to difficult substrates

Upper Making

Primer

Pidiprimer EP 294

Flammability: Flammable
Characteristic odour
Facilitates the adhesion of polyurethane adhesive to difficult substrates

Upper Making

Primer

Pidiprimer EP 294

Flammability: Flammable
Characteristic odour
Facilitates the adhesion of polyurethane adhesive to difficult substrates

Upper Making

Primer

Pidiprimer EP 294

Flammability: Flammable
Characteristic odour
Facilitates the adhesion of polyurethane adhesive to difficult substrates

See all apllications

High-Performance Adhesives for Electronics Assembly

Acrylate-Based Adhesives

Pidilite's acrylate adhesives are engineered for the precise demands of electronics assembly. These adhesives offer rapid curing, excellent adhesion to plastics, metals, and coated substrates, and flexibility to accommodate thermal expansion — making them ideal for bonding displays, sensors, and housings. Available in UV-cure variants, they support fast production cycles and clean processing on automated lines. HMPUR-based acrylates further enhance assembly strength and heat resistance in flexible and multi-layered device structures.

Epoxy Adhesives

Epoxy adhesives from Pidilite provide robust bonding solutions for electronic components that require high mechanical strength, thermal endurance, and resistance to environmental stress. Commonly used in PCB assembly, connector bonding, and structural reinforcements, they deliver strong adhesion and excellent electrical insulation properties. Select grades are compatible with UV-assisted curing workflows, while HMPUR-enhanced epoxy systems offer extended open time and superior long-term reliability under thermal cycling.

Silicate-Based Adhesives

Pidilite’s silicate adhesives are formulated for electronics applications that demand thermal stability, fire resistance, and chemical inertness. These inorganic adhesives perform reliably at elevated operating temperatures, making them suitable for power modules, thermal shields, and insulation barriers. Select formulations can be paired with UV-initiated processes for faster set times, and are compatible with substrates requiring non-flammable bonding under regulatory scrutiny.

Modified Silicate Adhesives

Our modified silicate adhesives combine the thermal endurance of traditional silicates with improved flexibility and adhesion to dissimilar materials ideal for electronics that undergo repeated heating and cooling cycles. These formulations are tailored for applications where thermal resistance and mechanical adaptability are both essential. HMPUR-compatible variants support bonding in modular devices and hybrid assemblies, offering enhanced gap-filling, flex crack resistance, and reliable sealing in challenging geometries.

Strategic Alliances for

Smarter Tech

Powering next-gen electronics with advanced adhesives and proven global partnerships

Pidilite’s partnership with CollTech brings globally validated adhesive systems to the heart of electronics manufacturing enabling precision bonding across smartphones, wearables, and wireless devices. CollTech’s strength in HMPUR, UV-cure, and acrylate-based chemistries is paired with Pidilite’s deep local R&D, application expertise, and supply assurance.

Together, we enable bonding solutions for display modules, sensor arrays, plastic and metal housings, and coil assemblies, with a focus on clean dispensing, thermal stability, and flexible performance across compact form factors. Every solution is engineered for fast-paced electronics lines, with grades that meet global regulatory standards and are tested for reliability under heat, pressure, and vibration.